Electronic Theses and Dissertation
Universitas Syiah Kuala
SKRIPSI
ANALISIS KONDUKTIVITAS TERMAL PAPAN PARTIKEL DARI JERAMI PADI DENGAN PEREKAT RESIN EPOKSI
Pengarang
FADHOLI RAHMAN SIREGAR - Personal Name;
Dosen Pembimbing
Nomor Pokok Mahasiswa
1508102010040
Fakultas & Prodi
Fakultas MIPA / Fisika (S1) / PDDIKTI : 45201
Subject
Penerbit
Banda Aceh : FAKULTAS MATEMATIKA DAN ILMU PENGETAHUAN ALAM UNIVERSITAS SYIAH KUALA., 2019
Bahasa
Indonesia
No Classification
536.2
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ABSTRACT
Heat in the room is caused by the human body, the equipment inside the room, and
heat flow from outside the room. Thermal insulation material is important for
decreasing excess heat entering from the environment outside the system. Thus,
efforts to utilize rice straw waste to manufacture particleboard as an alternative
thermal insulator are very potential. In this study, particleboards are made using a
mixture of rice straw and epoxy resin adhesive. The purpose of this study is to
determine the effect of particle size and composition of rice straw on thermal
conductivity, density, and porosity of particle boards to obtain the best particleboard
information for thermal insulators. The study purpose was carried out by varying the
particle size of rice straw (20, 40, 50, and 60 mesh) by rice straw composition using
epoxy resin with the comparison (vol.%) 80:20, 85:15, and 90:10 to determine its
effect on thermal conductivity, density, and porosity. Particleboard manufacturing
process is done by press using a hydraulic press machine with a load of 9 tons for 30
minutes in a 15cm x 15cm x 1cm mold, after mixing and stirring on rice straw
particles and epoxy resin. The test results obtained indicate that the increase in the
thermal conductivity of the particle board is in line with the decrease in particle size
and composition of rice straw with the lowest value of thermal conductivity 0,0336
W/m
o
C which obtained particle board with particle size of 20 mesh and rice straw
composition 90%. Density and porosity of particle boards have the opposite
relationship, where the increase in density generates a decrease in porosity of the
particleboard. Based on the thermal conductivity values obtained, rice straw particle
board with epoxy resin adhesive has low thermal conductivity compared to thermal
insulator on the market, so that it can be applied as a thermal insulator..
Keywords: thermal insulator, particleboard, rice straw, epoxy resin, thermal
conductivity.
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